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BUILD TO PRINT - Automated Element Attachment

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Void-Free Process

API's void-free process maintains maximum die-to-substrate surface contact eliminating poor signal propagation found in less sophisticated semiconductor or MMIC die attachment methods.

Low Temperature (280°C) Eutectic die attach methods also used for maximum diffusion involving 80Au 20Sn alloys.

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  • Void-Free Process

    Void-Free Process

    API's void-free process maintains maximum die-to-substrate surface contact eliminating poor signal propagation found in less sophisticated semiconductor or MMIC die attachment methods.

    Low Temperature (280°C) Eutectic die attach methods also used for maximum diffusion involving 80Au 20Sn alloys.

    Find Out More ›

  • Methods

    Methods

    Solder attach methods include: 98Au, 2Si, Sn96, Sn98, SAC 305 (RoHS). API performs high frequency bonding from DC to 50 GHz.

    Precision Millimeter-wave bonding techniques are essential, especially in Q-band applications.

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  • Expert Capabilities

    Expert Capabilities

    API’s automated die attach capabilities focus on the same high quality process control that our ISO 9001:2000 certification demands.

    Our reputation in the hybrid market is well deserved, as large and small projects are given the same high quality attention that made us a leader in this industry.

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  • Superior Accuracy

    Superior Accuracy

    Features include: accuracy 3 sigma to 10 micron, die placement rate to 3000/hr, chip placement rate to 8000/hr, flip chip capability, and direct CAD programming.

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