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Copper Filled Vias


Superior Conductivity for High Reliability Applications

API Technologies’ copper filled vias for thin film substrates feature high electrical conductivity, maximized thermal conductivity, and reliability at an affordable cost.

Copper filled vias are the preferred technology available for commercial packaging, hybrid manufacturers, and microelectronics providers in need of a high reliability and high conductivity substrate as it provides higher electrical and thermal conductivity to effectively dissipate heat from high power integrated circuits.

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FILLED VIA THIN FILM TECHNOLOGY


Copper Filled Vias

Copper vias provide higher conductivity and better thermal conductivity for RF/Microwave and high power applications compared to plated through hole.

API Technologies' copper filled vias feature high electrical conductivity, maximized thermal conductivity, and reliability all at an affordable cost.

The use of copper substrate is the preferred technology for commercial packaging, hybrid manufacturers, and microelectronics providers in need of a high reliability and high conductivity substrate.

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Features & Specifications

Features:
  • Affordable cost solution
  • Higher conductivity than solid gold filled vias
  • Diameters available from 0.005" to 0.015"
  • Available on alumina, alumina nitride, and beryllium oxide substrates
  • Thermal conductivity cooling path
  • Electrical conductance to back layer of substrate
  • Fired in a nitrogen atmosphere to prevent oxidation
  • Manufactured in a MIL-PRF-38534 Class H & K facility
Applications:
  • Defense and Security Applications
  • Radar and Infrared Detection
  • Optoelectronics
  • Light Emitting Diode (LED) Devices
  • Medical Electronics
  • HIgh Power RF/MIcrowave Applications

Conductor & Technology Comparisons


Copper vs. Gold Filled Vias

Because of their copper composition, copper filled vias are not only more economical, but also provide greater conductivity and longer life for high power, high reliability applications than their solid gold counterparts.

  • The thermal conductivity of copper (Cu) is 385.0 W/m K
  • The thermal conductivity of gold (Au) is 314.0 W/m K
  • The electrical conductivity of copper (Cu) is 5.96×107 (σ (S/m) at 20 °C)
  • The electrical conductivity of gold (Au) is 4.10×107 (σ (S/m) at 20 °C)

Filled Vias vs. Plated Through Holes

Filled vias provide higher conductivity and better thermal conductivity for RF/Microwave than plated through holes, and are preferable for high power applications. Filled vias and plated through holes both provide electrical connections to the ground plane in thin film substrates (also on PWBs/PCBs and thick film). Also, provides interconnects for thin film substrates with patterns on both sides of the substrates.

Thin Film Capabilities & Resources


About API Technologies Thin Film Capabilities

With over four decades of thin film experience, API Technologies is able to provide a complete solution for thin film products. API has extensive experience with thin film design, manufacturing and quality.

Our thin film capabilities include multiple substrate materials, conductor and resistor layers of various materials, plated through and filled interconnects, protective coatings and laser trimming, among others. API engages with our customers from design concept and layout assistance, prototype development and full production support.

Thin Film Resources:

COPPER VIA RESOURCES

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