Copper Filled Vias
Superior Conductivity for High Reliability Applications
API Technologies’ copper filled vias for thin film substrates feature high electrical conductivity, maximized thermal conductivity, and reliability at an affordable cost.
Copper filled vias are the preferred technology available for commercial packaging, hybrid manufacturers, and microelectronics providers in need of a high reliability and high conductivity substrate as it provides higher electrical and thermal conductivity to effectively dissipate heat from high power integrated circuits.REQUEST A COPPER FILLED VIAS QUOTE
FILLED VIA THIN FILM TECHNOLOGY
Copper Filled Vias
Copper vias provide higher conductivity and better thermal conductivity for RF/Microwave and high power applications compared to plated through hole.
API Technologies' copper filled vias feature high electrical conductivity, maximized thermal conductivity, and reliability all at an affordable cost.
The use of copper substrate is the preferred technology for commercial packaging, hybrid manufacturers, and microelectronics providers in need of a high reliability and high conductivity substrate.
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Features & Specifications
Conductor & Technology Comparisons
Copper vs. Gold Filled Vias
Because of their copper composition, copper filled vias are not only more economical, but also provide greater conductivity and longer life for high power, high reliability applications than their solid gold counterparts.
Filled Vias vs. Plated Through Holes
Filled vias provide higher conductivity and better thermal conductivity for RF/Microwave than plated through holes, and are preferable for high power applications. Filled vias and plated through holes both provide electrical connections to the ground plane in thin film substrates (also on PWBs/PCBs and thick film). Also, provides interconnects for thin film substrates with patterns on both sides of the substrates.
Thin Film Capabilities & Resources
About API Technologies Thin Film Capabilities
With over four decades of thin film experience, API Technologies is able to provide a complete solution for thin film products. API has extensive experience with thin film design, manufacturing and quality.
Our thin film capabilities include multiple substrate materials, conductor and resistor layers of various materials, plated through and filled interconnects, protective coatings and laser trimming, among others. API engages with our customers from design concept and layout assistance, prototype development and full production support.
Thin Film Resources: