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BUILD TO PRINT - Fluxless Soldering

Fluxless Soldering
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DAP Flux-Free Soldering

API’s DAP flux-free soldering provides a consistent and even distribution of solder thus eliminating voids which can cause poor grounding leading to parasitic and signal degradation, especially at higher frequencies.

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    DAP Flux-Free Soldering

    API’s DAP flux-free soldering provides a consistent and even distribution of solder thus eliminating voids which can cause poor grounding leading to parasitic and signal degradation, especially at higher frequencies.

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    Secure Bonding

    Flux use removes oxides from the substrate and inhibits further oxidation insuring both intimate substrate-to-alloy contact and a secure bond.

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    Value-added Features

    Flux-free soldering provides a lower thermal path, enhanced reliability and the lowest resistance RF ground performance.

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    Precision Processes

    API’s programmable vacuum/pressure furnaces enable this repeatable flux-free soldering through precise automatically controlled heating to levels of 500°C, inert gas environments at pressures up to 50 psig or vacuum levels down to 50 millitorr and regulated cooling rates.

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