DAP Flux-Free Soldering
API’s DAP flux-free soldering provides a consistent and even distribution of solder thus eliminating voids which can cause poor grounding leading to parasitic and signal degradation, especially at higher frequencies.
Flux use removes oxides from the substrate and inhibits further oxidation insuring both intimate substrate-to-alloy contact and a secure bond.
Flux-free soldering provides a lower thermal path, enhanced reliability and the lowest resistance RF ground performance.
API’s programmable vacuum/pressure furnaces enable this repeatable flux-free soldering through precise automatically controlled heating to levels of 500°C, inert gas environments at pressures up to 50 psig or vacuum levels down to 50 millitorr and regulated cooling rates.