Glob Top Techniques
Primary Encapsulation, or Glob Top, is a technique where a specific amount of resin is deposited over an open chip and its wire bonds.
These high performance resins provide mechanical support, while protecting wires and bonds from corrosive residues and contaminants.
Attention To Detail
The value added production service of epoxy dispensing boasts features including: high accuracy +/- .0005", dual head, and 2000 glob tops per hr.