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PLATED THROUGH VIAS


API Technologies offers both filled vias or plated through holes, part of the benefits of the API Technologies advantage. Our in-house laser drilling capabilities allow the customer to eliminate epoxy bonding in the assembly process for improved grounding and thermal conductivity.

Whether drilling on Alumina, Aluminum Nitride, BeO, Silica or Quartz, using API’s advanced laser drilling method ensures enhanced mounting convenience without the need for awkward bonding techniques.

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API Technologies' techniques in valuable metals deposition, wrap-around gold and double polyimide applications clearly show why we are leaders in the development of new thin film methods and processes.

We offer both filled vias or plated through holes.

We offer both filled vias or plated through holes.

Gold plated or metalized vias for improved ground plane connection or heat dissipation.

Gold plated or metalized vias for improved
ground plane connection or heat dissipation.

Our in-house laser drilling capabilities allow the<br />customer to eliminate epoxy bonding.

Our in-house laser drilling capabilities allow the
customer to eliminate epoxy bonding.

Our advanced laser drilling method ensures enhanced mounting convenience.

Our advanced laser drilling method ensures
enhanced mounting convenience.

We are the leaders in the development of new thin film methods and processes.

We are the leaders in the development of
new thin film methods and processes.

Thin Film Technology

Take our Thin Film Tour today!

Selective 360 degree; gold deposition with a thickness of 100-400 micro inches.

Selective 360° gold deposition with a thickness of 100-400 micro inches.

FEATURES
The API Advantage

The API Advantage

To download more information about the API advantage, click here! To message to one of our engineers about the Spectrum advantage, click here! To request pricing information about the API advantage, click here!
  • Few companies have the capability to provide edge and via wrap-around services as API Technologies does.
  • Gold plated or metalized vias for improved ground plane connection or heat dissipation.
  • Take our Thin Film tour to learn more!
Variety and Customization

Variety and Customization

To download more information about our variety and customization, click here! To message to one of our engineers about our variety and customization, click here! To request pricing information about our variety and customization, click here!
  • Selective 360° deposition allows for Gold to be deposited with a thickness of 100-400 micro inches.
  • View our Thin Film Brochure to learn more!
Various Metal Schemes

Various Metal Schemes

To download more information about our various metal schemes, click here! To message to one of our engineers about our various metal schemes, click here! To request pricing information about our various metal schemes, click here!
  • Metal schemes including Gold, Copper, Nickel, NiChrome and Tantalum Nitride line/spaces to ±0.000050”.
  • BeO, Alumina Nitride, Silicon and Ferrites are just some of the substrate materials available.

THIN FILM EXTRAS

FREE DESIGN SOFTWARE