PLATED THROUGH VIAS
API Technologies offers both filled vias or plated through holes, part of the benefits of the API Technologies advantage. Our in-house laser drilling capabilities allow the customer to eliminate epoxy bonding in the assembly process for improved grounding and thermal conductivity.
Whether drilling on Alumina, Aluminum Nitride, BeO, Silica or Quartz, using API’s advanced laser drilling method ensures enhanced mounting convenience without the need for awkward bonding techniques.
Scroll down to learn about:
API Technologies' techniques in valuable metals deposition, wrap-around gold and double polyimide applications clearly show why we are leaders in the development of new thin film methods and processes.